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D-Sub高黏度聯系器AMPHENOL

公布的時刻：2023-09-06 16:40:00     網頁瀏覽：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高度密集計算公式接連器90°角PCB線接有2種封裝類型眼界型號：法國開發計劃和軍工概念股用眼界。組合搭配方法區域接受外層要自始至終為杏淡黃色，能按照所需要要的充實組合搭配方法頻帶寬度挑選以下幾種大體板厚：閃爍金、15μ"和30μ"。接觸的面積點就能出示精密模具自動化處理的軍工概念股用級型號（額定負載直流電高至7.5A）以保障措施安全的可以信賴性，可以夠作為更經濟能力且可商業的額定功率電壓電流為3A的模具沖壓版本升級。

D-Sub高容重相連器標準化全系列常從A到E的5種大體金屬外殼規格型號，AMPHENOL的搭配連結器在數據表格數字信號、電和同軸拖鏈電纜個方面更具達18個玩點排列三。堆疊（雙服務器端口）D-Sub高強度接器設備系類該是多種多樣。AMPHENOL開張發的充當PIP焊結細長（或沉式或短型）類型在AMPHENOL的商務客中提升成就 。除此依我看，AMPHENOL還行為一切應用領域提供數據裝備，涉及黑色金屬蓋、橡膠防火蓋、保證罩、裝配裝備、寶寶血型轉變成和其余匹配器。

結構特征

標D形聯接器

EMI合金金屬硬殼

電源線插頭保護接地系統凹坑

插人件由阻燃型熱塑性朔膠變形朔膠制成而成

使用工商業章印碰觸點

提供全方向位置線接范疇的變體

種種線接尺寸規格均供給插板和插座

優勢與劣勢

加強組織領導恰當的配合默契八卦方位

最主要的應用于自動產生但降低直接費用的改善措施

UL#E232356證書

兼容各式各樣玩家供需

適用基準技術規范

特有款型適用于于管腳焊錫膏或回到焊

西安市立維創展科技開發選擇經銷處AMPHENOL新公司各大的領域企業產品型號，在AMPHENOL，AMPHENOL我相信在開始保險業務的整個過程中作出可堅持的取舍可能為股東的創造遠期和短期價格。AMPHENOL的每一位項銷售都著力推進于一直不斷完善其制作，集中采購，造成和交給服務的方式英文，努力奮斗滿足了或凌駕加盟商對所有價格鏈中服務處理的期望值。AMPHENOL 的的業務將可靠和環保呵護當做重在人物，并要根據ISO 14001和OHSAS 18001等認為標準的管理許多準備。只不過，認證服務和國內的法律合法合法性還達不到。AMPHENOL這樣不單單嚴守法律規范就能創作暫時顏值。

內容清楚AMPHENOL可點擊：//www.yhme.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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